| 摘要 |
The invention relates to a method of interconnecting an integrated circuit onto a carrier, as a replacement for the wiring. According to the invention, an integrated circuit chip (1) is fixed on a carrier (4) by brazing of the earth plane metallisations (18,20). However, the input/output lugs (7,13) of the integrated circuit are joined to the metallised tracks (8,9) of the carrier (4) by way of metallised holes (14,15). Application to microwave circuits. <IMAGE> |
