| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cold welding type power semiconductor device wherein a positioning jig as a mold is unnecessary for positioning a plurality of semiconductor elements, assembling is simplified, and arrangement of signal wiring without insulation coating film is possible. SOLUTION: The device is provided with a first insulating frame 3 of a lattice type which surrounds individually a plurality of semiconductor elements arranged on the same plane, and positions the respective semiconductor elements. First and second hard metal electrode plates 4, 3 are formed on both surfaces of the respective semiconductor elements. A first electrode part member 5 is formed in contact with the first hard metal electrode plates 4. On the first insulating frame 2 of a lattice type, a second insulating frame 6 of a lattice type which positions the second hard metal electrode plates 3 is stacked. A second electrode part member 7 having a lattice type trench into which the lattice type frame part of the second insulating frame 6 is fitted is arranged for positioning the frame.</p> |
