发明名称 METHOD AND DEVICE FOR PRODUCING BOARD IN SHAPE OF CURVED SURFACE
摘要 PROBLEM TO BE SOLVED: To freely select the shape of a curved surface and requested performance by letting age hardening type liquid state dielectric band flow into the mold of a three-dimensional curved surface to harden it and shaving off unwanted parts. SOLUTION: On a piller-shaped three-dimensional curved surface metal mold 11 for which an upper surface is formed into the shape to be applied to one side of a substrate, a conductor layer a1 is formed by depositing a copper foil film, for example. Next, a side wall metal mold 12 is fitted to the metal mold 11 along its peripheral surface, and age hardening type liquid state dielectric A islet flow into it and hardened. When this age hardening type liquid state dielectric A is completely hardened, the side wall metal mold 12 is drawn, the unwanted parts is shaven off by a three- dimensional cutting machine, and a dielectric layer a2 having dimensionally high precision is formed. Continuously, the side wall metal mold 12 is fitted again and on the upper surface of the dielectric layer a2, a dielectric layer a3 is formed by deposition, etc. Afterwards, by drawing the three-dimensional curved surface metal mold 11 and the side wall metal mold 12, a dielectric substrate in the shape of curved surface arranging the conductor layers a1 and a3 on the front side and rear side of the dielectric layer a2 can be provided.
申请公布号 JPH09139619(A) 申请公布日期 1997.05.27
申请号 JP19950298369 申请日期 1995.11.16
申请人 TOSHIBA CORP 发明人 NAKADA TAIHEI
分类号 B29C69/00;B29C45/14;H01Q3/26;H01Q15/14;H05K3/00;H05K3/02;H05K3/40;H05K3/46;(IPC1-7):H01Q3/26 主分类号 B29C69/00
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