SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device having a planar structure of multilayer interconnections, in which moisture is stopped from entering through fuse holes in order to prevent the degradation of device characteristics. SOLUTION: An opening 11 is provided in a cover film 10, an insulating film, etc., to blow a fuse 3, and it is surrounded by a dummy wiring layer 5X in a horizontal plane. The dummy wiring layer 5X is in the same plane as an SOG film 7 for flattening, and thus the former causes interruption in the continuity of the latter. Even if the SOG film 7 is partially exposed in the opening 11, the dummy circuit layer 5X serves as a shield so that moisture can not enter the circuit inside.