发明名称 ELECTRONIC PARTS HANDLING DEVICE, HANDLING METHOD AND MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To perform handling such as conveyance and alignment 10 a gentle state to electronic parts so as not to generate mechanical damage to the electronic parts. SOLUTION: A chamber 25 is provided below a perforated plate 22 with a large number of pores formed and with its upper face 28 inclined at a tilt angle 29 to a horizontal plane, and compressed air is led into the chamber 25 through a conduit 27 so as to discharge this compressed air to the upper face 28 side of the perforated plate 22. Electronic parts 31 positioned on the upper face 28 side of the perforated plate 22 are thereby placed in a state of floating from the perforated plate 22 and moved in accordance with the inclination of the upper face 28. The moved electronic parts 31 are received one by one into pockets 32 formed at a stopper wall 30 rotated around.
申请公布号 JPH09136716(A) 申请公布日期 1997.05.27
申请号 JP19950295054 申请日期 1995.11.14
申请人 MURATA MFG CO LTD 发明人 KUROME HIDEO;TAMURA KOUTA;WATANABE KENICHI
分类号 B65G29/00;B65G47/14;B65G51/03;H01G13/00;H05K13/02 主分类号 B65G29/00
代理机构 代理人
主权项
地址