Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices

摘要

A plurality of free-standing spring elements (512) are mounted to a surface (510a) of a carrier substrate (510). The carrier substrate (510) is mounted to a surface (502a) of a semiconductor device (502). Bond pads (504) of the semiconductor device are connected to the spring elements (512) by bond wires (520) extending between the bond pads (504) and terminals (516) associated with the spring elements. Alternatively, the carrier is flip-chip reflow soldered to the semiconductor device. The carrier substrate (510) is suitably mounted to one or more semiconductor devices (532, 534) prior to the semiconductor devices being singulated from a semiconductor wafer upon which they are formed. Resilience and compliance to effect pressure connections to the semiconductor device (502) are provided by the spring elements (512) extending from the carrier substrate (510), per se. Hence, the carrier substrate (510) suitably remains rigid with respect to the semiconductor device (502). The carrier substrate (510) is advantageously pre-fabricated, by mounting the spring elements (512) thereto prior to mounting the carrier substrate to the semiconductor device(s).