| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe structure excellent in strength and having a bump contact in which small projections with little dispersion are formed on the surface for each bump contact. SOLUTION: In a probe structure in which a bump contact 2 provided on one side 1a of an insulated substrate 1 is conducted with a conductor circuit provided on the other surface 1b, the bump contact 2 consists of a basic shape part 2a and small projections 2b formed on the surface, and at least a surface layer 23a and the small projections of the basic shape part are formed by precipitating the same contact material through the electroplating. The small projections are formed by controlling the electroplating current density so as to be locally projected from the surface of the surface layer 23a, and the surface layer 23a and the small projections consist of the material structures without any mutual boundaries. The hardness of the surface of the small projections is preferably >=700Hk to <=1200Hk. |
