Method for identifying molding compound using an acoustic microscope

摘要

A non-destructive method of identifying a type of molding compound in a sample using an acoustic microscope, particularly, identifying the type of molding compound used in an integrated circuit package by comparing attributes of the tested molding compound with known attributes of standard molding compounds to identify the molding compound being evaluated. The attributes that are compared include voltage, attenuation, peak frequency, average frequency, and the velocity of reflected sound.