METHOD FOR FORMING INTEGRATED CIRCUIT AND SYSTEM FOR INSPECTING DIE ON WAFER

摘要

PROBLEM TO BE SOLVED: To provide an improved method for forming an integrated circuit. SOLUTION: A die is manufactured as 'flip chip' by use of conventional technique and the manufactured die is inspected by an inspection system. Only a sub set of contact pad 201 is used at an inspection process. In a perffered embodiment, each pad of sub set on a flip chip is connected to a probe pad around a flip chip device by metallization or by another method. These probe pads are used in an inspection device and a selected signal is given to the device and the performance is inspected.