MANUFACTURE OF LAMINATED CERAMIC ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To enable a laminated ceramic electronic component to be protected against inner structural defects and enhanced in reliability by a method wherein a debinder process is carried out in a temperature rising stage in such an atmosphere that an electrode metal layer is not oxidized and then carried out in a temperature falling stage below such a temperature that the electrode metal layer is not oxidized in the air. SOLUTION: Electrode paste of Pd powder is printed on a ceramic green sheet, and ceramic layers and electrode metal layers are alternately laminated for the formation of a green chip. The green chips are put in an alumina sheath and subjected to a debinder process. A debinder process is carried out, in such an atmosphere that an electrode metal layer is not oxidized in a temperature rising stage and then carried out below such a temperature that the electrode metal layer is not oxidized in the air in a temperature falling stage. The amount of residual carbon in the chip ranges from 0.4 to 0.76wt%.