| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laser diode device wherein the connecting material between a semiconductor substrate and a heat sink has not only uniform electric and thermal conductivity but high mechanical stability. SOLUTION: A semiconductor substrate 1 is fitted to a heat sink consisting of a cooling body and an electric and thermal conductive terminal plate 3. The semiconductor substrate 1 is fixed on the terminal plate 3 which is fitted to the cooling body 12. The terminal plate 3 is made of material whose expansion coefficient is almost equivalent to that of the semiconductor material of the semiconductor substrate 1. A connecting layer 2 between the semiconductor substrate 1 and terminal plate 3 is formed of brazing solder for example. the cooling body 12 is fixed to the terminal plate 3 by a thermal conductive adhesive agent for example. A number of laser diode elements are made integrally, and the integrated body is divided thereafter.</p> |
