| 摘要 |
PROBLEM TO BE SOLVED: To enhance mounting density and tensile strength by a method wherein a lead is kinked at the base of the surface where the lead of an electronic part is passed, and the lead is soldered to the conductive pattern of a printed board. SOLUTION: The lead of an electronic part is successively inserted from the mounting side of the part into lead guides 106a3, 106b3, 106a5 and 106b5. Then, when cutter blocks 107a and 107b are pressed and moved to the direction of sliding blocks 106a2 and 106b2 by driving cylinders 109a and 109b, the lead is kink-treated on the upper part of the lead guides 106a3 and 106b3 by kink protruding parts 107a1 and 107b1, and the surplus tip is cut off between lead cutters 107a1, 107b1, cutters 107a2 and 107b2 and cutter supporting grooves 106a4 and 106b4. After repeating the above-mentioned operation on each electronic part, the conductive pattern of a printed board and the kink part are soldered. |
