| 摘要 |
PROBLEM TO BE SOLVED: To surely electrically connect a semiconductor chip to a bonding pad formed on a substrate by bonding the bumps of the chip to the upper surfaces of a plurality of fine conductive metallic projecting strips formed on the upper surface of the bonding pad by using a photosensitive film. SOLUTION: A substrate 10 and a bonding pad 12 formed on the substrate 10 are coated with a photosensitive film 14. Then recessing and projecting parts are formed on the pad 12 in a desired pattern by partially exposing the film 14 by using a photosensitive mask and developing the exposed parts of the film 14. After the pattern is formed, a conductive metal is vapor-deposited on the film 14 and substrate 10 by vapor deposition, sputtering, and electroplating. Then, after the film 14 and the conductive metal on the film 14 are removed, fine conductive metallic projecting strips 16 are formed on the upper surface of the pad 12 in a prescribed pattern and bottom faces of the bumps 24 of a semiconductor chip 13 are thermocompression-bonded to the upper surfaces of the strips 16. Therefore, the electrical connection between the semiconductor chip 13 and the substrate 10 can be obtained without detective connection. |
