SEMICONDUCTOR WAFER HOUSING STRUCTURE AND SEMICONDUCTOR WAFER HOUSING AND TAKE-OUT METHOD

摘要

PROBLEM TO BE SOLVED: To prevent occurrence of physical and electrical damages to wafers against shocks during carrying by housing the wafers stacked in a conductive box, inserting spacers between the wafers, and placing end cushions at the upper and lower ends of the wafers. SOLUTION: A wafer container is composed of a closed bottom tubular body 2 and cover 3. Wafers 4 are stacked and housed in a space 2e of the body 2 with spacer sheets 5 inserted between the wafers. The sheet 5 prevents the wafers 4 from contacting each other when they are stacked and electrostatic charges from generating between the wafers. End cushions 6A and 6B are disposed at the top and bottom of the space 2e to avoid direct contact of the wafer 4 with the bottom 2a of the body 2 and top face ribs 3c of the cover 3.