发明名称 |
Processing method and equipment for processing a semiconductor device having holder/carrier with flattened surface |
摘要 |
Process equipment and method for processing a semiconductor device comprising a buffer chamber, at least one process chamber connected to the buffer chamber through an opening portion, a holding/carrying unit disposed at a position facing the opening portion for holding and carrying a member to be processed such as a wafer, and a carrier unit disposed in the buffer chamber for transferring the member to be processed to and from the holding/carrying unit. The holding/carrying unit includes a flattened surface closely facing the opening portion for holding an atmosphere in the at least one process chamber independently from an atmosphere in the buffer chamber. The opening portion has a flattened surface closely facing the flattened surface of the holding/carrying unit.
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申请公布号 |
US5628828(A) |
申请公布日期 |
1997.05.13 |
申请号 |
US19950397991 |
申请日期 |
1995.03.03 |
申请人 |
HITACHI , LTD. |
发明人 |
KAWAMURA, YOSHIO;MORIYAMA, SHIGEO;YAMAMOTO, TATUHARU;UCHIDA, FUMIHIKO |
分类号 |
H01L21/677;C23C16/44;C23C16/458;C23C16/54;H01L21/00;H01L21/02;H01L21/027;H01L21/304;(IPC1-7):C23C16/00 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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