发明名称 |
COMPOSITE MICROWAVE CIRCUIT MODULE ASSEMBLY AND ITS CONNECTION STRUCTURE |
摘要 |
<p>A composite microwave circuit module assembly has a dielectric substrate which is formed by a lower layer, an intermediate layer and an upper layer. The lower layer and the upper layer include a lower ground surface and an upper ground surface, respectively, and the intermediate layer includes a radio frequency signal circuit formed by an active circuit element and a passive circuit element. A number of via-holes filled with metal are arranged along the radio frequency signal circuit to short-circuit the upper ground surface and the lower ground surface so as to shield the radio frequency signal circuit. An element mounting cavity is disposed on the intermediate layer with a portion of dielectric above the intermediate layer being removed, and the active circuit element is mounted on an element mounting land in the cavity. The cavity is covered by a conductor plate member. A connection terminal connected with the radio frequency signal circuit is provided in a surface of the dielectric substrate without projecting from the surface thereof and allows external electrical connection thereat from outside by a microwave circuit connection structure having a contact member resiliently urged to said connection terminal.</p> |
申请公布号 |
CA2109441(C) |
申请公布日期 |
1997.05.13 |
申请号 |
CA19932109441 |
申请日期 |
1993.10.28 |
申请人 |
NEC CORPORATION |
发明人 |
KOSUGI, YUHEI;YAMAMOTO, OSAMU;IZUMI, HIROAKI;KUSAMITSU, HIDEKI;OMAGARI, SHIN-ICHI;WATANABE, HIDEO;MINOWA, YOSHIO |
分类号 |
H01L23/552;H01P1/00;H01P5/107;(IPC1-7):H05K1/18 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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