发明名称 SOLDERING INSPECTION METHOD
摘要 In the soldering checking method including an image inputting step of shedding color stacked ring light on a circuit board and inputting images based on respective colors for a soldering image of parts positioned on the circuit board, to an image grabbing board, by a camera; an image processing step of corresponding colors for the images based on each color inputted from the image inputting step to a slant face of the soldering part; a specific value extracting step of extracting a characteristic of the image processed in the image processing step; and a deciding step of deciding a quality of the soldering part on the basis of the specific value extracted from the specific value extracting step, the method further comprises the steps of converting the images having each color inputted from the image inputting step into each of pure colors concerned with each angle on the subject to image processing regulations ruled by using a reference sample when each ring light is not the pure color in the image processing step; and performing a binary operation for the converted color and area.
申请公布号 KR970007543(B1) 申请公布日期 1997.05.10
申请号 KR19940005954 申请日期 1994.03.24
申请人 SAMSUNG ELECTRONICS CO.,LTD 发明人 CHO, HYUNG-SUK;KIM, JONG-HYUNG;KIM, JAE-SUN
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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