Mold cleaning mechanism for resin sealing/molding apparatus

摘要

In a resin sealing/molding apparatus for electronic parts, a cleaning UV application mechanism (17) for removing mold surface contaminants adhering to/accumulating on mold surfaces (16) is mounted to be freely reciprocative to a retracted position not inhibiting an operation for supplying unsealed lead frames (3) and resin tablets (6) to each resin sealing/molding part (8) and an operation for taking out sealed lead frames (9) and a position close to the mold surfaces (16) in each resin sealing/molding part (8). According to this structure, the mold surface contaminants, such as a mold release agent contained in a resin material or volatile gas generated by heating, adhering to/accumulating on the mold surfaces (16) of each resin sealing/molding part (8) are efficiently and reliably removed. <IMAGE>