| 摘要 |
An integrated multi-layered microwave circuit includes a substrate which is constituted by dielectric layers and conductive layers laminated alternately. The conductive layer disposed at one major surface of the substrate forms a micro strip line which constitutes an antenna portion. The conductive layer disposed at the other major surface of the substrate forms a circuit pattern including a grounding line and a power source line, and then the circuit pattern forms a communication portion together with discrete parts incorporated in the circuit pattern. One of the intermediate conductive layers of the substrate constitutes a grounding layer and the other thereof constitutes a power source layer. In the substrate, a feeding via hole, a via hole for a power source, and a grounding via hole are formed so as to penetrate the substrate. Conductors are formed on the inner walls of the substrate forming the feeding via hole, the via hole for the power source, and the grounding via hole by the plating technique, respectively, whereby the antenna portion, the power source layer and the grounding layer are electrically connected to the communication portion, the power source line and the grounding line, respectively. The antenna portion is provided with a feeding land connected to the conductors of the feeding via hole, three radiators each having a circular configuration formed by the micro strip line, and a phase shifter formed by the micro strip line for connecting the respective radiators to the feeding land.
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