MANUFACTURE OF LEAD FRAME

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a lead frame which can correspond to further multi-terminal and high density of a semiconductor device. SOLUTION: For manufacturing a lead frame wherein at least an inner lead tip part is made thinner than a lead frame raw material and partial plating for wire bonding is applied to the thin part, at first, a tip of an inner lead part of a lead frame is connected by a connection part and at least an inner lead tip part is made thinner than a lead frame raw material and outline processing is performed for an outer lead part and others to a thickness of a lead frame raw material (a). Then, plating solution is sprayed to at least an inner lead tip part of the outline-processed lead frame by using a masking jig for applying plating (b). Thereafter, a tape for fixing an inner lead part is sticked and a connection part for connecting a tip of an inner lead part is cut and removed (d).