METAL LEAD WITH BUMP AND ITS MANUFACTURING METHOD,申请号JP19950273091-传众专利搜索

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发明名称	METAL LEAD WITH BUMP AND ITS MANUFACTURING METHOD
摘要
申请公布号	JPH09115965(A)	申请公布日期	1997.05.02
申请号	JP19950273091	申请日期	1995.10.20
申请人	SONY CORP	发明人	KOBAYASHI HIROTAKA
分类号	H01L21/60;H01L23/50;(IPC1-7):H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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