发明名称 COMPONENT MOUNTING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To make a mounting part for mounting a component to be mounted changeable, in response to height difference of the component, by making it possible for the swinging end of a swinging part member to swing around a center which is the linkage end of the swinging part member of a swinging means. SOLUTION: When the height of an electronic component to be mounted is less than that of an ordinary electronic component, a control part 100 gives a specific command signal to a motor 8, in accordance with the height of the short electronic component. Thereby a swinging lever 14 is revolved by a rotation angle. The swinging end 4b of the lever 4 always swings with an ordinary swinging angle θc . The upper fulcrum UD of a nozzle pusher 21 does not change, but the lower fulcrum only is changed by the amount which has increased from a stroke LA to a stroke LB. Thereby correspondence with the height of the short electronic component is possible. Hence a component mounting equipment corresponds to the height of the component to be mounted, sucks the component, and can mount the component on an object like a printed board.
申请公布号 JPH09116296(A) 申请公布日期 1997.05.02
申请号 JP19950292156 申请日期 1995.10.13
申请人 SONY CORP 发明人 TOI YUTAKA
分类号 B23P21/00;H05K13/04 主分类号 B23P21/00
代理机构 代理人
主权项
地址