| 摘要 |
PROBLEM TO BE SOLVED: To prevent solder from reaching the end surface of an active layer, by making the active layer a bent surface approaching one main surface of a semiconductor substrate, toward the outside end surface, as compared with a main flat surface of the active layer, in the vicinity of the outside end surface where insulating coating of the active layer is not formed or imperfect. SOLUTION: A trench G having an U-shaped or V-shaped section is formed at a position for forming an outside end surface where insulating coating is not formed between a plurality of semiconductor laser constituting parts of a main surface 1a of a semiconductor substrate 1 or the insulating coating is imperfect. A buffer layer, a first clad layer 11, a second clad layer 12, an active layer 2 and a cap layer 3 are grown in order on the main surface 1a of the semiconductor substrate 1 containing the inside of the trench G. In this case, the active layer 2 is formed as a surface wherein the semiconductor film surface is bent along the bottom surface of the trench G. Both side end surfaces 2a, 2b of the active layer 2 which face both outside surfaces of a semiconductor chip are made distant from a fixing part 24, so that solder 23 can be prevented from reaching the end surfaces. |
