| 摘要 |
PROBLEM TO BE SOLVED: To provide satisfactory characteristics even at both a matching capacitor part and a central conductor part while maintaining the low height of parts without lowering reliability or workability due to soldering and to improve characteristics or quality as entire parts as well. SOLUTION: Different materials are used for a central conductor part 100 and a matching capacitor part 110, and suitable materials are respectively selected. As the substrate materials of the central conductor part 100, the materials satisfying the conditions such as low loss, low dielectric constant and thin film are selected. As the substrate materials of the matching capacitor part 110, the materials satisfying the conditions such as low loss and high dielectric constant are selected. The materials are selected corresponding to the characteristics requested to the respective parts so that characteristics or quality can be improved as entire parts. Besides, a buffer layer is provided between the central conductor part and the matching capacitor part so that the difference of shrinking behavior between different types of materials can be relaxed. |
