发明名称 Improvements in or relating to semiconductor wafer fabrication
摘要 An apparatus integrating pad conditioning device (44) with a wafer carrier device (24) for chemical-mechanical polishing applications includes an attaching mechanism (45) for associating conditioning device (44) with wafer carrier device (24). Conditioning surface (84) of conditioning device (44) conditions the polishing pad associates with attaching mechanism (45). Carrier device (24) receives and holds wafer (42) so that wafer (42) and conditioning surface (44) contact the polishing pad (42) to simultaneously condition polishing pad (26) and polish wafer (42). <IMAGE>
申请公布号 EP0770454(A1) 申请公布日期 1997.05.02
申请号 EP19960116991 申请日期 1996.10.23
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 APPEL, ANDREW THORTON;CHISHOLM, MICHAEL FRANCIS
分类号 B24B53/007;B24B53/017;H01L21/304 主分类号 B24B53/007
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