发明名称 |
Improvements in or relating to semiconductor wafer fabrication |
摘要 |
An apparatus integrating pad conditioning device (44) with a wafer carrier device (24) for chemical-mechanical polishing applications includes an attaching mechanism (45) for associating conditioning device (44) with wafer carrier device (24). Conditioning surface (84) of conditioning device (44) conditions the polishing pad associates with attaching mechanism (45). Carrier device (24) receives and holds wafer (42) so that wafer (42) and conditioning surface (44) contact the polishing pad (42) to simultaneously condition polishing pad (26) and polish wafer (42). <IMAGE> |
申请公布号 |
EP0770454(A1) |
申请公布日期 |
1997.05.02 |
申请号 |
EP19960116991 |
申请日期 |
1996.10.23 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
APPEL, ANDREW THORTON;CHISHOLM, MICHAEL FRANCIS |
分类号 |
B24B53/007;B24B53/017;H01L21/304 |
主分类号 |
B24B53/007 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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