发明名称 |
Method of making semiconductor wafers. |
摘要 |
A method for a flatter semiconductor wafer free of ORP -observed irregularity and particles generated in handling on the back side of the wafer, in which an alkaline etching is adopted to utilize its advantage and a slight polishing step is combined to a conventional method of this kind. A deficiency of alkaline etching which brings about rougher surface irregularities on the surface of a wafer is eliminated by the use of the step of slight polishing on the back surface after the etching step and the inherent advantage stands without a loss, so that particle generation from the back surface of a semiconductor wafer in handling is much reduced and what's more a flatter semiconductor wafer is realized and a yield of an electronic device fabrication grows the higher. <IMAGE> |
申请公布号 |
EP0628992(A3) |
申请公布日期 |
1997.05.02 |
申请号 |
EP19940303951 |
申请日期 |
1994.06.01 |
申请人 |
SHIN-ETSU HANDOTAI COMPANY LIMITED |
发明人 |
KATO, TADAHIRO;NAKANO, MASAMI;SHIMA, SUNAO;MASUMURA, HISASHI |
分类号 |
H01L21/02;H01L21/302;H01L21/304;H01L21/306;H01L21/463 |
主分类号 |
H01L21/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|