发明名称 Verfahren zum Positionieren eines Bauteils, das mit einer Platte verbunden ist oder einen Teil derselben bildet, sowie Vorrichtung zum Durchführen des Verfahren, und nach diesem Verfahren hergestellte Platte
摘要 <p>Method of producing a plate-shaped product comprising positioning a component (22; 23; 122) on or of a plate (20) which is supported by a bearing (14) and is supported at the position of the component (22; 23; 122) to be positioned by a support (8). The positioning is carried out by means of a die (10) which together with the support is controlled by a control system, comprising comparators (24, 30) and amplifiers (25, 31), in such a way that the component (22; 23; 122) is positioned with very great accuracy relative to a reference plane (26) through the plate. When the desired position of the component is reached it is ensured that no elastic deformations are present in the plate. For this purpose, a device for carrying out the method comprises means (29, 30, 31, 32; 8, 36, 38; 138, 148) which control the die (10) and/or the support (8) or bear the die and the support or the plate (20) in such a way that the plate is free from elastic deformations at least when the component reaches the desired position. <IMAGE></p>
申请公布号 DE69030307(D1) 申请公布日期 1997.04.30
申请号 DE1990630307 申请日期 1990.12.18
申请人 PHILIPS ELECTRONICS N.V., EINDHOVEN, NL 发明人 STREEFLAND, GERARDUS JOHANNES JOSEPH, NL-5656 AA EINDHOVEN, NL;KRAAKMAN, HILLEBRAND JOHANNES JOSEPHUS, NL-5656 AA EINDHOVEN, NL;RUYTEN, HENRICUS MARIA, NL-5656 AA EINDHOVEN, NL;HUETTER, HEINRICH, NL-5656 AA EINDHOVEN, NL;TROWAL, WALTER, NL-5656 AA EINDHOVEN, NL
分类号 B21D43/00;B21D11/10;B21D22/04;B23P19/02;B23P19/04;B23P21/00;H05K7/04;(IPC1-7):B23P19/02 主分类号 B21D43/00
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