METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, AND LEADFRAME AND DIFFERENTIAL OVERLAPPING APPARATUS THEREFOR

摘要

The present invention proposes a method of manufacturing semiconductor devices from an elongated leadframe by using a differential overlapping apparatus. The leadframe has longitudinally spaced pairs of staggered leads. The overlapping apparatus functions to deform the leadframe during transfer thereof, so that each pair of staggered leads assumes the same longitudinal position but displaced away from each other perpendicularly to a plane containing the leadframe. The leadframe is further deformed to cause the pair of leads to move toward each other, so that a semiconductor chip is sandwiched between the pair of leads for bonding.