发明名称 |
Apparatus and method for developing resist coated on a substrate |
摘要 |
A developing apparatus comprising a spin chuck for rotating a wafer while keeping the wafer substantially horizontal with a resist-coated surface up, a nozzle for supplying developer, from above and obliquely, to the resist-coated surface of the wafer on the sign chuck, a source for supplying the developer to the nozzle, a cup arranged enclosing a peripheral portion of the wafer on the spin chuck and having a drain passage through which the developer supplied to the wafer is drained, and a belt drive mechanism for moving the nozzle in a horizontal plane to discharge the developer to the wafer in such a direction that follows the wafer rotating.
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申请公布号 |
US5625433(A) |
申请公布日期 |
1997.04.29 |
申请号 |
US19950535895 |
申请日期 |
1995.09.28 |
申请人 |
TOKYO ELECTRON LIMITED;TOKYO ELECTRON KYUSHU LIMITED |
发明人 |
INADA, HIROICHI;TSUNEMATSU, KUNIE |
分类号 |
B05D1/40;B05C5/00;B05C11/08;G03F7/20;G03F7/30;H01L21/027;(IPC1-7):G03D5/00;G03D3/02 |
主分类号 |
B05D1/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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