| 摘要 |
A screen printing apparatus and method suitable for applying solder paste on a printed circuit board, wherein a printed circuit board is brought just under a mask plate with patterned holes. The patterned holes are filled with solder paste. The printed circuit board is separated from the mask plate using intermittent movements that lower the adhesivity of the solder paste located nearest to the walls of the patterned holes so that the solder paste is easily separated from the patterned holes and the solder paste, which remains on the printed circuit board, is not deformed.
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