Chip-card module with manufacturing method

摘要

A non-conductive substrate layer with a window opening (5) and through holes has individual conductive contact areas (4) on one side. An IC component (2) is introduced through the window opening. The contacts on the IC are electrically connected to the contact areas on the substrate. Each connection is carried out via a through hole. The electrical connections, at least from the IC contacts to the through holes are manufactured wholly by a silk-screen printing process. In one embodiment the through holes are filled with a conductive print paste.