Form und Verfahren zur Herstellung von Kunststoffpackungen für integrierte Schaltungen die eine freie metallische Wärmesenke enthalten zur Inspektion der Lötverbindung

摘要

A mold (10) is disclosed for semiconductor devices intended for surface mounting, being of a type which comprises a metal plate (12) and a plastics body (20). It consists of two plates (10a,10b) which delimit at least one hollow (11) adapted to receive the plate (12) and to contain plastics for forming the device body (20). Two elements (16) of the mold (10) push the plate (12) from opposed sides against the bottom of the hollow (11). The hollow (11) has two side extensions (18) which are delimited by the side surfaces of the plate edges, thereby plastics projections (22) are formed thereon which separate readily after the molding process. Thus, a structure is obtained wherein the plate (12) has its bottom surface and two side edge portions fully exposed to allow of optimum and controllable soldering to a printed circuit board.