| 摘要 |
PCT No. PCT/JP93/00839 Sec. 371 Date Dec. 19, 1994 Sec. 102(e) Date Dec. 19, 1994 PCT Filed Jun. 22, 1993 PCT Pub. No. WO94/00880 PCT Pub. Date Jan. 6, 1994This invention aims at providing a glass package type capacitive element having a high reliability and a high resistance to heat and mechanical impact. In the glass package, a semiconductor device (2) is connected with a lead (5) through a conductor (8) having a bent structure.
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