发明名称 |
Thin film forming apparatus using laser |
摘要 |
A thin film forming apparatus using laser includes a chamber (1), a target (5) placed therein, a laser light source (10) for emitting laser beam to target (5), and a substrate holder (3). When target (5) is irradiated with laser beam (16), a plume (15) is generated, and materials included in plume (15) are deposited on the surface of a substrate (2) held by substrate holder (3). The laser beam emitted from laser light source (10) has its cross section shaped to a desired shape when passed through a shielding plate (4804), for example, so that the surface of the target (5) is irradiated with the beam having uniform light intensity distribution. Therefore, a plume (15) having uniform density distribution of active particles is generated, and therefore a thin film of high quality can be formed over a wide area with uniform film quality, without damaging the substrate.
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申请公布号 |
US5622567(A) |
申请公布日期 |
1997.04.22 |
申请号 |
US19930158844 |
申请日期 |
1993.11.29 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
KOJIMA, KAZUYOSHI;TAKAMI, TETSUYA;KURODA, KENICHI;OISHI, TOSHIYUKI;WADA, YUKIHIKO;FURUKAWA, AKIHIKO |
分类号 |
C23C14/02;C23C14/08;C23C14/22;C23C14/28;C23C14/34;C23C14/54;C23C14/56;(IPC1-7):C23C14/00 |
主分类号 |
C23C14/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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