| 摘要 |
PROBLEM TO BE SOLVED: To provide a component mounting structure and a method, wherein parts are quickly fixed to a printed board with thermosetting resin without sweeping away conductive adhesive agent from a bump. SOLUTION: A conductive adhesive agent layer B is provided on bumps 21 on a component 2, an insulating adhesive agent A is interposed between the component 2 and the printed board 1, the bumps 21 are heated as pressed against pads 11 on the printed board 1 to cure the insulating adhesive agent A before the conductive adhesive agent B is hardened, and the insulating adhesive agent A enhanced in fluidity by pressing and heating is cured before it starts to flow out, whereby the conductive adhesive agent layer B is restrained from being swept away from the bumps 21, and the component 2 is quickly fixed to the printed board 1.
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