MANUFACTURE OF PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To eliminate desmear treatment by eliminating smear in an inner wall of a non-through hole and an upper side of a non-through hole by shaping a non-through hole by using CO2 laser of a short pulse in an insulation layer consisting of epoxy resin which does not contain glass cloth. SOLUTION: An adhesive layer 25 is formed on an insulation layer 51 consisting of epoxy resin which does not contain glass cloth. A non-through hole 26 which passes through the adhesive layer 25 and the insulation layer 51 consisting of epoxy resin which does not contain glass cloth and attains an inner layer circuit 23 is shaped by using a short pulse CO2 laser of pulse width of 10<-4> to 10<-8> second. A plating resist 27 consisting of epoxy resin is formed on the adhesive layer 25 not to allow copper plating to attach to a part except a part wherein an outer layer circuit 28 is formed. A non-through conduction hole 29 is formed by applying plating to a non-through hole while the outer layer circuit 28 is formed by electroless plating. Then, the plating resist 27 is removed and a printed wiring board is prepared.