| 摘要 |
PROBLEM TO BE SOLVED: To obtain balanced filling of a cavity, a small conductor hall-down rate, a small cavity-defect generation rate, etc., by using a molding-compound inserting body with a molding compound sealed into a sproutless-package opened by pressure. SOLUTION: A molding-compound inserting body 71 having a molding compound 73 packaged in a sproutless-package and being opened by bursting the package at a specified place by pressure generated when the package is compressed is used. The molding-compound inserting body 71 is arranged into a molding-compound receptor, and the molding-compound inserting body 71 is compressed so that the molding compound 73 is discharged from the molding- compound inserting body 71 and begins to be moved into a sprue runner. The molding compound 73 is transferred into the sprue runner, and compression is continued until each of a top-section mold cavity and a bottom section mold cavity is filled with the molding compound 73. |
