| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of easily and surely forming bumps uniform in height and shape. SOLUTION: In a ball forming process, the tip of a gold wire which protrudes from the tip of a capillary of a wire bonding device is fused into a ball. In a following ball pressure-bonding process, the ball formed at the tip of the gold wire is bonded to a substrate 7 by pressure at a bump forming position and formed like a nail head. In a wire cut process, the gold wire 3 is properly plucked off. In a leveling process, a plucked part 3a is fused by an electric discharge and formed like a ball. In result, a bump 10 complicated in shape is formed. |
