| 摘要 |
PROBLEM TO BE SOLVED: To prevent a power module device from deteriorating in wire bonding properties by a method wherein irregularities are provided to the mounting surfaces of a resin case main body and a wiring board corresponding to the direction of irradiation with ultrasonic waves in a wire bonding process. SOLUTION: An Al wire 11 is pressed against the bonding face of a terminal 6 with proper loading, ultrasonic vibrations are given to the Al wire 11 along the lengthwise direction of the terminal 6 to connect the external terminal 6 to an input/output terminal 4 with the Al wire 11. At this point, as irregularities 5 and 9 are provided to a metal wiring board 1 and a resin case main body 7 respectively along the direction in which ultrasonic waves are radiated, rigidity between the terminal 6 and the metal wiring board 1 along that direction in which ultrasonic waves are radiated is enhanced, so that a stable bonding operation can be carried out even if loading or powder given to the bonding face of the terminal 6 becomes large because of the increase of the Al wire 11 in diameter. |
