发明名称 |
SOLDER-COATED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are formed such that a projecting height H of a pad from the board body surface and a width W of the pad satisfy a relation 2H < W, that a pad array is formed in which a width of each of the pads located at two ends of the pad array is larger than that of a pad located therebetween, and that the pad width W and a pad-to-pad distance D satisfy a relation W > D. A solder layer, obtained by a substitution reaction between a powder of a metal having the highest ionization tendency among metals constituting the solder layer or a powder of an alloy thereof and a salt formed by bonding the other metal or metals in the solder layer to an organic acid, is formed on each pad.
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申请公布号 |
CA2063682(C) |
申请公布日期 |
1997.04.15 |
申请号 |
CA19922063682 |
申请日期 |
1992.03.20 |
申请人 |
FURUKAWA ELECTRIC CO., LTD. (THE);HARIMA CHEMICALS, INC. |
发明人 |
KOSUGA, IZUMI;FUSE, KENICHI;FUKUNAGA, TAKAO;SHIROISHI, HIROKAZU;KOHNO, MASANAO;IRIE, HISAO |
分类号 |
B23K35/02;B23K35/34;H05K1/11;H05K3/34;(IPC1-7):H05K1/09;H05K3/24 |
主分类号 |
B23K35/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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