SEMICONDUCTOR LASER DEVICE AND OPTICAL PICKUP DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent the deterioration of material and optical characteristics by bringing an insulating member as sealing material into contact with a laser light emitting point. SOLUTION: A semiconductor laser chip 4 is mounted on a die pad 2. A light emitting part 9 of the semiconductor laser chip 4 is covered with a transparent optical member 6. The semiconductor laser chip 4, the die pad 2, electrode terminals 3 and the optical member 6 are covered with a transparent insulating member 11, except outer terminal parts of the electrode terminals 3. Thereby a semiconductor laser device mounted on a lead frame 1 which is free from deterioration of optical characteristics and suitable for mass production is obtained.