| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump structure for soldering by forming solder layers only on a semiconductor chip side while a long interval is secured between a mounting substrate and the chip. SOLUTION: Bumps having two-layer structures are only formed on a chip 1 and, at the time of soldering, the bumps are connected to electrodes 11 on a mounting substrate 10. Since the lower layers 3a of the two-layer structures do not melt at the time of soldering, a fixed interval can be secured between the substrate 10 and the chip 1. At the soldering time, the upper layers 3b melt and the bumps are electrically connected to the electrodes 11. It is preferable to make the melting point of the lower layers 3a higher than that of the upper layers 3b by >=20 deg.C. |
