发明名称 MANUFACTURE OF CIRCUIT MODULE
摘要 <p>PROBLEM TO BE SOLVED: To provide a manufacturing method, for a circuit module, whose tact time is short and in which the circuit module can be manufactured with good accuracy. SOLUTION: A manufacturing method comprises a process wherein a carrier 1 which comprises a plurality of holding parts 2 used to hold a work 5 and which is provided with adhesive tapes on the holding parts 2 is prepared, a process wherein the work 5 is aligned with the carrier 1 and the work 5 is pasted on the adhesive tapes, a process wherein a treatment is executed to the work 5 held by the carrier 1 while the position of the carrier 1 is used as a reference and a process wherein the adhesive force of the adhesive tape is lowered after the treatment has been finished and the work 5 is removed from the carrier 1.</p>
申请公布号 JPH0997971(A) 申请公布日期 1997.04.08
申请号 JP19950253143 申请日期 1995.09.29
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKAI TADAHIKO;SAKAMI SEIJI
分类号 H05K3/34;H01L21/60;H01L21/68;H01L21/683;H01L23/12;H05K3/00;H05K3/12;(IPC1-7):H05K3/34 主分类号 H05K3/34
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