发明名称 |
MANUFACTURE OF CIRCUIT MODULE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method, for a circuit module, whose tact time is short and in which the circuit module can be manufactured with good accuracy. SOLUTION: A manufacturing method comprises a process wherein a carrier 1 which comprises a plurality of holding parts 2 used to hold a work 5 and which is provided with adhesive tapes on the holding parts 2 is prepared, a process wherein the work 5 is aligned with the carrier 1 and the work 5 is pasted on the adhesive tapes, a process wherein a treatment is executed to the work 5 held by the carrier 1 while the position of the carrier 1 is used as a reference and a process wherein the adhesive force of the adhesive tape is lowered after the treatment has been finished and the work 5 is removed from the carrier 1.</p> |
申请公布号 |
JPH0997971(A) |
申请公布日期 |
1997.04.08 |
申请号 |
JP19950253143 |
申请日期 |
1995.09.29 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SAKAI TADAHIKO;SAKAMI SEIJI |
分类号 |
H05K3/34;H01L21/60;H01L21/68;H01L21/683;H01L23/12;H05K3/00;H05K3/12;(IPC1-7):H05K3/34 |
主分类号 |
H05K3/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|