| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the sticking of film forming substance deposited on a substrate holder to the rear side of a semiconductor wafer at the time of conveying a semiconductor wafer by an automatized sputtering device. SOLUTION: The semiconductor wafer mounting part 28 of a substrate holder 14 is the part corresponding to the place at which the orientation flat part 12a of a semiconductor wafer 12 is set, and it is approximately parallel to the orientation flat part 12 and has an almost ring shape. Thus, the contamination of the semiconductor wafer caused by film forming substance stuck to the rear side of the semiconductor wafer is eliminated to improve the production yield of semiconductors.</p> |
