| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a field emission type element and a method of manufacturing which never bring the breakage in process or the continuity between a gate line and an emitter line by vacuum sealing utilizing low melting point glass, nor cause the adhesion failure of an element base. SOLUTION: A plurality of field emission emitters 8 are formed in matrix on an element base 21, and a plurality of emitter lines 23 for commonly driving each field emission emitter 8 in one direction are formed by the same emitter electrode material film as the field emission emitters 8. A plurality of gate lines 22 arranged on the emitter lines 23 through an insulating film 5, having an opening part 4 for enclosing each field emission emitter 8, and commonly driving each field emission emitter 8 in the other direction are formed. Each gate line 22 is connected to a gate leading line 26 pattern-formed apart from each emitter liner 23 by an emitter electrode material film through a through- hole 13, and leaded to an external terminal.</p> |
