发明名称 THIN FILM WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To obtain a wiring board wherein a plurality of resistors having specified electric resistance values are integrally stuck on a part between wiring conductors, by making all the length directions of a plurality of the resistors identical. SOLUTION: An insulating substratum 1 acts as a retainer for supporting wiring conductors 2 and resistors 3. The thickness of an adhesion layer 2a constituting the wiring conductors 2 is in the range of 100-10000Å. The thickness of a main conductor layer 2b is at least 2μm, because the electric resistance value of the wiring conductor 2 is high when the thickness is less than 2μm. The line width and the thickness of the resistors 3 are made uniform by thin film forming technique, and the electric resistance values are set as arbitrary accurate values. While the insulating substrutum 1 is rotated, the adhesion layer 2a and resistance material turning to the resistors 3 are stuck on the substratum 1. Although the resistor material is different in crystal state, all the resistors turn in the same direction, so that the electric resistance values can be made arbitrary accurate values. Thereby a plurality of resistors having specified electric resistance values can be integrally formed between the wiring conductors 2.</p>
申请公布号 JPH0992938(A) 申请公布日期 1997.04.04
申请号 JP19950245828 申请日期 1995.09.25
申请人 KYOCERA CORP 发明人 KOBAYASHI YASUNORI
分类号 H05K1/16;H01C7/00;H05K1/02;H05K3/38;(IPC1-7):H05K1/02 主分类号 H05K1/16
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