| 摘要 |
A method for embedding an electronic component (3), particularly a microcircuit (3) having contact pads (4) on one side thereof, in one surface (1) of the body of an electronic card made of thermoplastic material. The method comprises the steps of heating the card body at least in an embedding region designed to receive the electronic component, in order to soften the thermoplastic material therein, and embedding the electronic component in the softened thermoplastic material in such a way that the side with the contact pads is facing away from the card body. The method is characterised in that it includes a preliminary step of depositing projections (5) made of conductive material and having a uniform or substantially uniform height on the contact pads (4) of the electronic component (3), and in that the embedding step comprises exerting a suitable pressure on the projections (5) until their free ends are flush with the embedding surface (1) of the card body. |
