THERMOSETTING COMPOSITION

摘要

A thermosetting film adhesive according to the present invention is obtained by irradiating a precursor composition and converting it into a film shape, the precursor composition including: a) an epoxy resin not having a radiation-polymerizable functional group; b) a curing agent for curing the epoxy resin; c) a first radiation-polymerizable compound capable of reacting with one, or both, of the epoxy resin and the curing agent at the time of heat-curing; d) a second radiation-polymerizable compound not chemically reacting with the epoxy resin and the curing agent; and e) solid rubber particles; wherein the components b) and e) are dispersed in a matrix phase comprising the components a), c) and d), and which is liquid at a normal temperature.