METHOD OF ELECTRICALLY CONNECTING A SEMICONDUCTOR CHIP TO AT LEAST ONE CONTACT SURFACE
摘要
The invention concerns a method of electrically connecting a semiconductor chip (1) to at least one contact surface by means of a thin wire whose first end is welded to the at least one contact surface and whose second end is connected to a contact area of the semiconductor chip (1). In order to establish a good connection between the wire and the contact area of the semiconductor chip (1), the second end of the wire is welded to a wedge-shaped metal part (5) which is disposed on the contact area of the semiconductor chip (1) and is conductively connected thereto. The metal part (5) is formed by a nailhead contact (6) whose free end is guided in a loop and connected to the nailhead by a wedge contact.
申请公布号
WO9712394(A1)
申请公布日期
1997.04.03
申请号
WO1996DE01783
申请日期
1996.09.19
申请人
SIEMENS AKTIENGESELLSCHAFT;HEITZER, JOSEF;KIRSCHBAUER, JOSEF;STAMPKA, PETER