CIRCUIT HAVING TRIM PADS FORMED IN SCRIBE CHANNEL

摘要

In accordance with the present invention, trim pads (24) used in trimming on-chip resistive elements (15a-15c) are formed in the scribe channels (12) interposed between respective dice (21, 22, 23) on a wafer (20). Metal traces (24a) connect the trim pads (24) to their associated resistive elements (15a-15c) formed on the dice (21, 22, 23). Thus, each trim pad (24) formed within the scribe channels (12) results in a corresponding increase in the usable silicon surface area of the dice (21-23), thereby saving valuable silicon real estate.